Thermoforming device and thermoforming method using hot plate heating

摘要

A thermoforming device using a hot plate heating includes a frame; a hot plate; a decompression unit connected to the frame; a decompression unit which is connected to a hot plate; a unit which is connected to the hot plate and opens a heating surface side to an atmosphere or pressures the heating surface side; an adsorption and heating control unit which performs the adsorption and heating operation of the sheet by the hot plate; a decompression control unit which performs a decompression operation in the concave portion; and a molding operation control unit which concurrently performs the adsorption and heating operation and the decompression operation, stops the adsorption and heating operation of the sheet after a predetermined time from the start of the operation, and opens a portion between the hot plate and the sheet to the atmosphere or pressures the portion.

主权项

1. A thermoforming device comprising:
a frame which has a base portion, a peripheral wall portion erected on a periphery of the base portion, and a concave portion formed by the base portion and the peripheral wall portion; a hot plate which has a heating surface facing the concave portion of the frame and a heating unit that heats the heating surface, the hot plate being in contact with the heating unit; a decompression unit which is connected to the frame, is configured to decompress an inner portion of the concave portion covered by a sheet, the sheet being fixed to an upper end of the peripheral wall portion of the frame, the decompression unit being connected to the hot plate, the decompression unit being configured to suck the heating surface side of the hot plate; a unit which is connected to the hot plate and opens the heating surface side to an atmosphere or pressures the heating surface side; and an adsorption and heating control unit which is configured to perform an adsorption and heating operation of the sheet by the hot plate.