SUPPORTING GLASS SUBSTRATE AND MANUFACTURING METHOD THEREFOR

摘要

[Problem] To contribute to the densification of semiconductor packages by providing: a supporting glass substrate suitable for supporting a processed substrate used in high-density wiring; and a manufacturing method for said substrate. [Solution] A supporting glass substrate of the present invention is characterized in that when said substrate is raised from room temperature to 400°C at a rate of 5°C/minute, kept at 400°C for 5 hours, and returned to room temperature at a rate of 5°C/minute, the thermal shrinkage is 20 ppm or less.