METHODS FOR ADHESIVE BONDING OF ELECTRONIC DEVICES

摘要

In accordance with certain embodiments, electronic components such as light-emitting elements are bonded to connection points on a substrate via pressure applied via a membrane and curing of a pressure-activated adhesive.

主权项

1. A method of fabricating an electronic device, the electronic device comprising a plurality of electronic components each bonded to a connection point on a substrate, the method comprising:
positioning each of the plurality of electronic components over a different connection point on the substrate; providing a pressure-activated adhesive between each electronic component and its connection point; providing a membrane over the plurality of electronic components and the substrate; applying a pressure, via the membrane, substantially simultaneously between each electronic component and its connection point; and curing the pressure-activated adhesive, thereby bonding each electronic component to its connection point.