发明名称 METAL-INSULATOR-METAL (MIM) CAPACITORS AND FORMING METHODS
摘要 The present disclosure relates a metal-insulator-metal (MIM) capacitor. In some embodiments, the MIM capacitor has a capacitor bottom metal (CBM) electrode arranged over a semiconductor substrate. The MIM capacitor has a high-k dielectric disposed over the CBM electrode and a capacitor top metal (CTM) electrode arranged over the high-k dielectric layer. The MIM capacitor has a dummy structure that is disposed vertically over the high-k dielectric layer and laterally apart from the CTM electrode. The dummy structure includes a conductive body having a same material as the CTM electrode.
申请公布号 US2016218172(A1) 申请公布日期 2016.07.28
申请号 US201514606265 申请日期 2015.01.27
申请人 Taiwan Semiconductor Manufacturing Co., Ltd. 发明人 Hsieh Ching-Pei;Hsu Chern-Yow;Liu Shih-Chang
分类号 H01L49/02;H01L21/311 主分类号 H01L49/02
代理机构 代理人
主权项 1. A metal-insulator-metal (MIM) capacitor, comprising: a capacitor bottom metal (CBM) electrode disposed over a semiconductor substrate; a high-k dielectric layer disposed over the CBM electrode; a capacitor top metal (CTM) electrode disposed over the high-k dielectric layer; and a dummy structure disposed vertically over the high-k dielectric layer and laterally apart from the CTM electrode, wherein the dummy structure comprises a conductive body having a same material as the CTM electrode.
地址 Hsin-Chu TW