发明名称 |
METAL-INSULATOR-METAL (MIM) CAPACITORS AND FORMING METHODS |
摘要 |
The present disclosure relates a metal-insulator-metal (MIM) capacitor. In some embodiments, the MIM capacitor has a capacitor bottom metal (CBM) electrode arranged over a semiconductor substrate. The MIM capacitor has a high-k dielectric disposed over the CBM electrode and a capacitor top metal (CTM) electrode arranged over the high-k dielectric layer. The MIM capacitor has a dummy structure that is disposed vertically over the high-k dielectric layer and laterally apart from the CTM electrode. The dummy structure includes a conductive body having a same material as the CTM electrode. |
申请公布号 |
US2016218172(A1) |
申请公布日期 |
2016.07.28 |
申请号 |
US201514606265 |
申请日期 |
2015.01.27 |
申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
发明人 |
Hsieh Ching-Pei;Hsu Chern-Yow;Liu Shih-Chang |
分类号 |
H01L49/02;H01L21/311 |
主分类号 |
H01L49/02 |
代理机构 |
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代理人 |
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主权项 |
1. A metal-insulator-metal (MIM) capacitor, comprising:
a capacitor bottom metal (CBM) electrode disposed over a semiconductor substrate; a high-k dielectric layer disposed over the CBM electrode; a capacitor top metal (CTM) electrode disposed over the high-k dielectric layer; and a dummy structure disposed vertically over the high-k dielectric layer and laterally apart from the CTM electrode, wherein the dummy structure comprises a conductive body having a same material as the CTM electrode. |
地址 |
Hsin-Chu TW |