ELECTRONIC DEVICE AND ELECTRONIC PACKAGE THEREOF

摘要

An electronic package is provided, including a substrate and a semiconductor chip. The substrate has a plurality of substrate pads. The semiconductor chip is mounted on the substrate, wherein the semiconductor chip includes a plurality of chip pads electrically connected to the substrate pads of the substrate respectively, and the substrate pads and the chip pads are both trapezoidal.

主权项

1. An electronic package, comprising:
a substrate having a plurality of substrate pads; and a semiconductor chip mounted on the substrate, wherein the semiconductor chip comprises a plurality of chip pads electrically connected to the substrate pads of the substrate respectively.