Source Down Semiconductor Devices and Methods of Formation Thereof

摘要

A method for forming a semiconductor device includes forming device regions in a semiconductor substrate having a first side and a second side. The device regions are formed adjacent the first side. The method further includes forming a seed layer over the first side of the semiconductor substrate, and forming a patterned resist layer over the seed layer. A contact pad is formed over the seed layer within the patterned resist layer. The method further includes removing the patterned resist layer after forming the contact pad to expose a portion of the seed layer underlying the patterned resist layer, and forming a protective layer over the exposed portion of the seed layer.

主权项

1. A semiconductor device comprising:
a chip comprising
a diced semiconductor substrate,a seed layer disposed over and overlapping with an entire major surface of the diced semiconductor substrate,a patterned contact pad disposed over and covering a portion of the seed layer, anda diced carrier material disposed at sidewalls of the patterned contact pad.