ELECTRONIC PACKAGE STRUCTURE

摘要

An electronic package includes a lead frame structure having one or more structural features configured to improve board level reliability. In one embodiment, the structural feature comprises lead frame protrusions extending outward from the electronic package, which are configured to laterally engage solder structures used to attach the electronic package to a next level of assembly. In another embodiment, conductive bumps are attached to exposed portions of the lead frame in advance of next level assembly processes. In a further embodiment, the lead frame comprises laterally separated contact points for attaching an electron die and for attaching the electronic package to a next level of assembly.

主权项

1. An electronic package structure comprising:
a substrate comprising:
a die pad having die pad top surface and an opposing die pad bottom surface, wherein the die pad comprises a conductive material;a plurality of leads laterally spaced apart from the die pad; anda substrate encapsulant interposed between the die pad and the plurality of leads, wherein the substrate encapsulant has a substrate top surface and an opposing substrate bottom surface, and wherein the die pad and the plurality of leads protrude outward from the substrate bottom surface; an electronic die electrically coupled to the die pad and the plurality of leads; and a package body encapsulating the electronic die and the substrate top surface, wherein the substrate bottom surface is exposed to the outside.