Electronic module and method for manufacturing electronic module

摘要

The Electronic Module includes body case 2 that comprises a plurality of case members 3, 4 by abutting each other and that has an internal space (S) where the first opening P1 is formed on one side surface of the internal space (S) and the second opening P2 that opens in a direction different from that of the first opening P1 is in an exposed state when a plurality of the case members 3, 4 are separated each other, a substrate 5 on which a sensor IC 51 is mounted and that is housed in the internal space (S) of the body case 2, and a resin body 6 that covers the substrate 5 by being filled in the internal space (S) of the body case 2 and solidified or hardened, and is characterized by that a plurality of the case members 3, 4.

主权项

1. An Electronic Module, comprising:
a body case comprising a plurality of case members comprising a first case member and a second case member, the first case member making an abutting contact to the second case member, the body case having an internal space, a first opening formed on one side surface of the internal space, and a second opening that opens in a direction different from the first opening, the second opening opens when the second case member is separated from the first case member, a substrate on which an electronic component is mounted, the substrate being housed in the internal space, and a resin body that covers the substrate, the resin body filled into the internal space and solidified or hardened therein, wherein the second case member is inserted into the first case member to close the second opening, wherein a concave part is formed on the second case member opposite to the second opening and facing to the first opening prior to filling the resin body, and wherein said plurality of the case members and the substrate are integrated by the use of the resin body as an accouplement.