Method of sealing and shielding for dual pressure MEMs devices

摘要

The present disclosure relates to a MEMs substrate. In some embodiments, the MEMs substrate has a device substrate having a micro-electromechanical system (MEMs) device, and a layer of bonding material positioned over the device substrate at positions adjacent to the MEMs device. A cap substrate has a depression is disposed within a surface abutting the layer of bonding material. The depression within the cap substrate forms a chamber vertically disposed between the device substrate and the cap substrate and abutting the MEMs device. One or more pressure tuning channels are vertically disposed between the device substrate and the cap substrate and laterally extend outward from a sidewall of the chamber.

主权项

1. A MEMs (micro-electromechanical system) substrate, comprising:
a device substrate having a micro-electromechanical system (MEMs) device; a layer of bonding material positioned over the device substrate at positions adjacent to the MEMs device; a cap substrate comprising a depression disposed within a surface abutting the layer of bonding material, which forms a chamber vertically disposed between the device substrate and the cap substrate and abutting the MEMs device; and one or more pressure tuning channels vertically disposed between the device substrate and the cap substrate and laterally extending outward from a sidewall of the chamber, wherein the one or more pressure tuning channels comprise one or more openings arranged within upper horizontal surfaces of the one or more pressure tuning channels.