发明名称 |
Micro-flex technology in semiconductor packages |
摘要 |
Thin-film microflex twisted-wire pair and other connectors are disclosed. Semiconductor packages include microflex technology that electrically connects at least one chip to another level of packaging. Microflex connectors, such as thin-film twisted-wire pair connectors according to the present invention provide superior electrical performance, which includes reduced line inductance, incorporation of integrated passive components, and attachment of discrete passive and active components to the microflex. All of these features enable operation of the chip at increased frequencies.
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申请公布号 |
US2001039074(A1) |
申请公布日期 |
2001.11.08 |
申请号 |
US20010894706 |
申请日期 |
2001.06.28 |
申请人 |
BERTIN CLAUDE LOUIS;FERENCE THOMAS GEORGE;HOWELL WAYNE JOHN;FIFIELD JOHN ATKINSON |
发明人 |
BERTIN CLAUDE LOUIS;FERENCE THOMAS GEORGE;HOWELL WAYNE JOHN;FIFIELD JOHN ATKINSON |
分类号 |
H01L23/495;H01L23/498;H01L25/065;H05K1/02;(IPC1-7):H01L21/48 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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