| 摘要 |
<p>The invention relates to a method of hermetically sealing a space, more particularly of manufacturing electronic components (9), such as CCD's, LCD's and sensors, mainly consisting of a support (13) and a covering plate (17) enclosing a cavity (19), in which a moisture-sensitive element (15) is arranged and which is hermetically sealed in that the covering plate (17) is secured by means of a thermosetting glue (5) to the support (13), the operation of curing the thermo-setting glue (5) being carried out in a hermetically sealed chamber (11).</p> |
