| 摘要 |
PURPOSE:To mount a semiconductor chip on a mounting board by means of a simple operation by a method wherein the semiconductor chip and an auxiliary board are reversed up and down without changing their relative positions and the loop part of a wire situated between their gap is aligned with an electrode at the mounting board and is bonded to the electrode. CONSTITUTION:An electrode 1 at a semiconductor chip 2 and an electrode 3 at an auxiliary board 6 are wire-bonded, and a loop part 4 is formed. They are reversed up and down and placed on a mounting board 7. At this time, the semiconductor chip 2 is separated from the mounting board 7 by using a spacer 5. The loop part 4 of a wire is positioned so as to be situated on an electrode 8 at the mounting board 7. A pressure contact maker 10 is inserted from the gap between the semiconductor chip 2 and the auxiliary board 6; the wire of the loop part 4 is bonded to the electrode 8 at the mounting board 7. |
