发明名称 Method of bending and soldering corners of a folding printed-circuit board
摘要 A method of bending and soldering corners of a folding printed-circuit board in which holes are drilled on the printed-circuit board at points at where the circuits intersect the joints of segments of the folding printed-circuit board; V-shaped grooves are cut on the printed-circuit board along the joints of segments, permitting the printed-circuit board to be bent into a desired shape; and the drilled circuits are connected by soldering adequate amount of tin solder in the holes on the circuits.
申请公布号 US5257718(A) 申请公布日期 1993.11.02
申请号 US19930037908 申请日期 1993.03.26
申请人 CHIU, MING T. 发明人 CHIU, MING T.
分类号 H05K1/00;H05K1/09;H05K3/00;H05K3/10;H05K3/12;H05K3/34;H05K3/36;(IPC1-7):H05K3/00;H05K1/18 主分类号 H05K1/00
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