发明名称 |
Soldering ceramic body into electrical component - includes using intermediate tin coating and lead-tin coating not applied electrolytically |
摘要 |
In a method of soldering a ceramic body of an electrical component, e.g. microwave resonator, into a metal housing, the body with an electrically conducting coating of Cu or Ni-Cu, is plated with a 1-2 mu thick coating of Sn, while the surface of the housing to which it is soldered in plated with a 20 mu thick coating of a high m.pt. Pb-Sn alloy, e.g. by cold rolling on the surface. ADVANTAGE - Avoids the need for electrolytic plating from a Pb-Sn bath and environmental consequences.
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申请公布号 |
DE4229163(A1) |
申请公布日期 |
1994.03.03 |
申请号 |
DE19924229163 |
申请日期 |
1992.09.01 |
申请人 |
SIEMENS MATSUSHITA COMPONENTS GMBH & CO. KG, 81541 MUENCHEN, DE |
发明人 |
BLOCK, CHRISTIAN, DIPL.-ING., GRAZ, AT |
分类号 |
B23K1/19;B23K1/00;B23K1/20;C22C11/06;C23C2/08;C23C22/00;H01P11/00;(IPC1-7):B23K35/24;B23K20/00;H01C17/02;H03H3/00 |
主分类号 |
B23K1/19 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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