LEAD FRAME FOR LAMINATION, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING IT, AND MANUFACTURE OF THE DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a lead frame for lamination which is stabilized in mechanical strength and, at the same time, to manufacture a highly reliable LSI by using the lead frame. SOLUTION: A plurality of lead frames 1 for lamination each of which has flat sections 2 for fixing a semiconductor chip 7 and bent sections 4 and 5 which are extended upward and downward on the left and right sides of the flat section 2 is provided. The arbitrary bent sections 4 and 5 of the frames 1 are electrically connected to each other and semiconductor chips 7 are respectively fixed to the flat sections 2. At the same time, the electrodes of each semiconductor chip 7 are electrically connected to inner leads at the flat sections 2 of each lead frame 1. Then only one lead frame 1 is led out and used as an external electrode.