LOW-EMI PACKAGE CIRCUIT AND DEVICE,申请号JP19950341288-传众专利搜索

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发明名称	LOW-EMI PACKAGE CIRCUIT AND DEVICE
摘要
申请公布号	JPH09181263(A)	申请公布日期	1997.07.11
申请号	JP19950341288	申请日期	1995.12.27
申请人	HITACHI LTD	发明人	AKIBA YUTAKA
分类号	H01L25/00;H01L21/822;H01L23/64;H01L27/04;(IPC1-7):H01L27/04	主分类号	H01L25/00
代理机构		代理人
主权项
地址

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