| 摘要 |
PURPOSE: A wafer polishing apparatus is provided to measure each lower pressure of a pad conditioner head and a conditioning pad by installing a pressure sensor within a clean cup. CONSTITUTION: A rotary plate is installed on an upper surface of a base body. A polishing pad is formed on the rotary plate and includes a polishing side. A wafer carrier is used for absorbing a wafer, transferring the wafer to the polishing pad, and rotating the wafer. A slurry supply part is used for supplying a slurry to the polishing pad. A pad conditioner head(21) is rotated or elevated. A conditioning pad(22) is adhered to a lower part of the pad conditioner head. A pad conditioner includes a supporter connected to the pad conditioner head and the base body. A clean cup(30) includes a cavity, an N2 supply hole, a deionized water supply hole, and a deionized water drain hole. A pressure sensor(35) is formed at a bottom part of the clean cup in order to measure each lowering pressure of the conditioner head and the conditioning pad.
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