| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a formation method of a resistance element in which the range of the resistance value of each resistance element in a plurality of resistance elements formed by the same metal film is large in the formation method of the resistance element using the metal film that can be micromachined. <P>SOLUTION: In the formation method for forming the plurality of resistance elements on a wiring circuit board using the metal film, different treatment is made to the plurality of specific resistance elements formed by the same metal film, thus forming the resistance element having a different resistance value depending on the presence or absence of treatment. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
