FILM-LIKE ADHESIVE FOR SEALING SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a film-like adhesive for sealing a semiconductor capable of manufacturing a semiconductor device being sufficiently excellent in workability when it is used for sealing the semiconductor device, sufficiently suppressing generation of a void even when it is heated to 300°C or higher and being sufficiently excellent in connection reliability and insulation reliability.

SOLUTION: The film-like adhesive for sealing the semiconductor contains an epoxy resin (a) and a curing promoter (b). Further, the curing promoter (b) has a melting point of 120°C or higher, and an active area of the curing promoter (b) is 120°C or higher.

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