| 摘要 |
A light emitting diode package is provided to achieve superior mechanical strength by utilizing a ceramic substrate and a resin packing unit, and to improve heat emission property by a conductive via offering a heat passageway. An LED(Light Emitting Diode) comprises a ceramic substrate(101) and an LED chip. A first conductive via(130a) and a second conductive via(130b) penetrate the ceramic substrate. The LED chip is mounted on the first conductive via. The first via and the second via are positioned, and separated from each other in order to divide electrodes. A transparent resin packing unit(107) for packing the LED chip is formed on the ceramic substrate. The LED chip has a horizontal structure on which a first electrode and a second electrode are formed.
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