| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxidized polyphenylene ether resin having preferable heat resistance and showing no decrease in moisture absorption resistance compared to conventional products. SOLUTION: The epoxidized polyphenylene ether resin is expressed by general formula (1) (wherein, m and n represent integers of 1 or more; each of R<SB>1</SB>, R<SB>2</SB>, R<SB>3</SB>and R<SB>4</SB>independently represents a hydrogen atom, a halogen atom or a monovalent functional group; each of X<SB>1</SB>and X<SB>2</SB>independently represents a functional group having an epoxy group; and Y represents biphenylsulfone.). COPYRIGHT: (C)2009,JPO&INPIT
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