发明名称 Semiconductor device and manufacturing method thereof
摘要 A semiconductor device includes a substrate, a p-channel MIS transistor formed on an n-type well on the substrate, having a first gate dielectric and a first gate electrode formed thereon and formed of a Ta-C alloy wherein a crystal orientation ratio of a TaC (111) face in a film thickness direction [TaC (111) face/{TaC (111) face+TaC (200) face}] is 80% or more, and an n-channel MIS transistor formed on a p-type well on the substrate, having a second gate dielectric and a second gate electrode formed thereon and formed of a Ta-C alloy wherein a crystal orientation ratio of a TaC (111) face in a film thickness direction [TaC (111) face/{TaC (111) face+TaC (200) face}] is 60% or less.
申请公布号 US2009075464(A1) 申请公布日期 2009.03.19
申请号 US20080232080 申请日期 2008.09.10
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 KOYAMA MASATO;ICHIHARA REIKA;TSUCHIYA YOSHINORI;KAMIMUTA YUUICHI;NISHIYAMA AKIRA
分类号 H01L21/28 主分类号 H01L21/28
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