发明名称 |
Feature Dimension Measurement |
摘要 |
A method of measuring dimensional characteristics includes providing a substrate and forming a reflective layer over the substrate. A dielectric layer is then formed over the reflective layer. The dielectric layer includes a grating pattern and a resistivity test line inset in a transparent region. Radiation is then directed onto the dielectric layer so that some of the radiation is transmitted through the transparent region to the reflective layer. A radiation pattern is then detected from the radiation reflected and scattered by the metal grating pattern. The radiation pattern is analyzed to determine a first dimensional information. Then the resistance of the resistivity test line is measured, and that resistance is analyzed to determine a second dimensional information. The first and second dimensional informations are then compared.
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申请公布号 |
US2009152545(A1) |
申请公布日期 |
2009.06.18 |
申请号 |
US20070958942 |
申请日期 |
2007.12.18 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
SU CHING-CHUNG;CHIU YI-WEI;WENG TZU-CHAN;CHIU YIH SONG;SU PIN CHIA;JENG CHIH-CHERNG;WEI KUO-HSIU |
分类号 |
H01L23/58;H01L21/66 |
主分类号 |
H01L23/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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