| 摘要 |
Provided is an active matrix substrate (2) comprised of first connecting wires (641, 643, 645, 647) connected to a gate terminal (51) which is connected to lead wires (611, 613, 615, 617), second connecting wires (642, 644, 646) connected to the gate terminal (51) which is connected to lead wires (612, 614, 616), bundled wires (651 - 654) which bundle two mutually adjacent wires of a first connecting wire and a second connecting wire into one wire, a first inspection wire (66) which can input an inspection signal to the bundled wires (652, 654) which are not adjacent in the bundled wires, and a second inspection wire (67) which can input an inspection signal to the bundled wires (651, 653) which do not connect to the first inspection wire (66) and are not adjacent in the bundled wires. |
