| 摘要 |
The present invention provides a downward evaporation deposition device and an evaporation deposition device. The downward evaporation deposition device includes: a dielectric tube which is mounted around a through hole formed on the top plate of a vacuum container; an induction coil which is placed to surround the dielectric tube; an AC current source which supplies AC power to the induction coil; and an evaporation unit which is placed inside the dielectric tube, is induced to be heated by the induction coil, stores a deposition material, and discharges the deposition material. The evaporation unit includes: a deposition material storage space; a gas guide unit which protrudes from the lower surface of the deposition material storage space and includes a through hole at the center; and a cover unit which covers the gas guide unit and is made of a conductive material. The cover unit is immersed by the deposition material, and the deposition material is sprayed through the through hole of the gas guide unit. |
