| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a semiconductor device.SOLUTION: A semiconductor device comprises: a substrate having a terminal provided on an upper surface thereof; a semiconductor element disposed on the upper surface of the substrate and having an electrode electrically connected with the terminal of the substrate; an encapsulation member provided so as to surround the circumference of the semiconductor element, on the upper surface of the substrate; and a covered bottomless cylindrical member fixed to the encapsulation member and covering an upper part of the semiconductor element. The cylindrical member has a lid part and a side wall. The side wall is overlapped with the terminal of the substrate in a top view, or alternatively, the side wall is located inside the terminal of the substrate in a top view. With respect to the cylindrical member, a lower end of the side wall is buried in the encapsulation member, or alternatively, the lower end of the side wall is fixed to the upper surface of the encapsulation member.SELECTED DRAWING: Figure 2 |
