发明名称 SUBSTRATE FOR LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING SUBSTRATE FOR LIGHT EMITTING DEVICE
摘要 A high heat dissipation effect and a high light utilization efficiency are realized. A substrate for a light emitting device includes an aluminum substrate (1), a high heat dissipation ceramic layer (2) disposed on the aluminum substrate (1), an etching frame (3) disposed on the high heat dissipation ceramic layer (2), and a highly reflective ceramic layer (4) disposed on the high heat dissipation ceramic layer (2) and the etching frame (3).
申请公布号 US2016233401(A1) 申请公布日期 2016.08.11
申请号 US201415022603 申请日期 2014.10.01
申请人 SHARP KABUSHIKI KAISHA 发明人 KONISHI Masahiro;NOKUBO Hiroyuki;ITOH Shin;NAKANISHI Takashi;YAMAGUCHI Ippei;FUJITA Yuhsuke
分类号 H01L33/64;H01L33/60;H01L33/62 主分类号 H01L33/64
代理机构 代理人
主权项 1: A substrate for a light emitting device, comprising: a metal substrate portion having at least a metal substrate; a first insulating layer which is disposed on the metal substrate portion and which has thermal conductivity; a second insulating layer which is disposed on the first insulating layer and which has light reflectivity; and a wiring pattern embedded inside the second insulating layer and having an electrode terminal portion which electrically connects thereto an electrode of a light emitting element, the first insulating layer having thermal conductivity higher than the thermal conductivity of the second insulating layer, the second insulating layer having light reflectivity higher than the light reflectivity of the first insulating layer, the electrode terminal portion having thickness larger than the thickness of a portion, which is other than an electrode terminal portion, of the wiring pattern, and the electrode terminal portion being exposed.
地址 Osaka JP