| 摘要 |
PROBLEM TO BE SOLVED: To provide an interlayer connection substrate that is low in cost and high in transmission quality and reliability.SOLUTION: In an interlayer connection substrate, a first substrate is inserted into a second substrate so that the first substrate is electrically connected to the second substrate, the first substrate having a cross section formed in a multistep shape where a lower part is small and an upper part is large, and the second substrate having a recessed portion, which is formed to be matched to the outer shape of the first substrate, formed thereto; and wirings of the first substrate and wirings of the second substrate are electrically connected at a step part of the first substrate and at a step part of the second substrate facing the step part of the first substrate.SELECTED DRAWING: Figure 24 |
