发明名称 CONDUCTIVE PASTE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste composition consisting of copper as a conductive component capable of achieving stable conductive reliability at low cost by using a specific thermoplastic elastomer as a binder component.SOLUTION: The above described problem is solved by a conductive paste composition containing a structure of the followings (A) to (C). (A) conductive particle containing copper:100 pts.wt. (B) thermoplastic acryl block copolymer having mass average molecular weight of 40,000 to 75,000:5 to 15 pts.wt. (C) organic solvent capable of dissolving or uniformly dispersing the (B) component:1 to 20 pts.wt.SELECTED DRAWING: Figure 1
申请公布号 JP2016170929(A) 申请公布日期 2016.09.23
申请号 JP20150049040 申请日期 2015.03.12
申请人 THREE BOND CO LTD 发明人 SUGIMOTO KENICHIRO;MAFUNE HITOSHI
分类号 H01B1/22;C08K3/08;C08L53/00;H01B1/00 主分类号 H01B1/22
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