发明名称 OPTOELECTRONIC DEVICE PACKAGES
摘要 An optical proximity sensor comprises a light detector die including a light detector sensor area and at least one bond pad on a portion of the light detector die not including the light detector sensor area. A light source die, including anode and cathode terminals, is attached to a portion of the light detector die not including the light detector sensor area, such that at least one of the terminals of the light source die, on a bottom of the light source die, is attached to at least one of the bond pads on the light detector die. An opaque barrier, formed off-wafer relative to a wafer including the light detector die, is attached to and extends upward from a top surface of the light detector die between the light detector sensor area and the light source die. Electrical connectors are on the bottom of the light detector die.
申请公布号 US2016306072(A1) 申请公布日期 2016.10.20
申请号 US201615055852 申请日期 2016.02.29
申请人 Intersil Americas LLC 发明人 A Tharumalingam Sri Ganesh
分类号 G01V8/12 主分类号 G01V8/12
代理机构 代理人
主权项 1. An optical proximity sensor, comprising: a light detector die that includes a light detector sensor area and at least two bond pads on a portion of the light detector die that does not include the light detector sensor area; a light source die including anode and cathode terminals and attached to a portion of the light detector die that does not include the light detector sensor area, such that at least one of the terminals of the light source die, which is on a bottom of the light source die, is attached to at least one of the bond pads on the light detector die; an opaque barrier, formed off-wafer relative to a wafer including the light detector die, attached to and extending upward from a top of the light detector die between the light detector sensor area and the light source die so that the entire light source die is on an opposite side of the opaque barrier than the light detector sensor area; electrical connectors for both the light detector sensor area and the light source die on a bottom of the light detector die; and vias in the light detector die that electrically connect the light detector sensor area and the anode and cathode terminals of the light source die to respective ones of the electrical connectors that are on the bottom of the light detector die.
地址 Milpitas CA US