发明名称 |
Curable resin composition, adhesive composition, cured object or composite |
摘要 |
A curable resin composition that is adhesive and transparent. The curable resin composition comprises (1) a polymerizable vinyl monomer, (2) a curing agent, (3) a reducing agent, and (4) an acrylic block copolymer having a structure represented by formula (1):
[a1]-[b]-[a2] (1)
wherein [a1] and [a2] each independently represents a polymer block which consists mainly of structural units derived from an alkyl acrylate and/or an alkyl methacrylate and has a glass transition temperature of 90° C. or higher, and [b] represents a polymer block which consists mainly of structural units derived from an alkyl acrylate and/or an alkyl methacrylate and has a glass transition temperature of −10° C. or lower, the copolymer satisfying the relationship (total mass of [a1] and [a2]/(mass of [b])=5/95 to 80/20. |
申请公布号 |
US9518200(B2) |
申请公布日期 |
2016.12.13 |
申请号 |
US201013318057 |
申请日期 |
2010.04.30 |
申请人 |
Denka Company Limited |
发明人 |
Miyazaki Hayato;Watanabe Jun;Suto Hiroshi |
分类号 |
C09J133/08;C09J133/10;C09J153/00;C08F287/00 |
主分类号 |
C09J133/08 |
代理机构 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
代理人 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
主权项 |
1. A curable resin composition, comprising:
a polymerizable vinyl monomer, a curing agent comprising an organic peroxide, a paraffin, a (meth)acrylic acid, a reducing agent, and an acrylic block copolymer having a structure of formula (II):
[a1]-[b]-[a2] (II) wherein [a1] is a polymer block consisting of polymethylmethacrylate, and having a glass transition temperature of from 100 to 120° C.; [a2] is a polymer block consisting of polymethylmethacrylate, and having a glass transition temperature of from 100 to 120° C.; [b] is a polymer block consisting of poly-n-butylacrylate, and having a glass transition temperature of from −50 to −45° C.; a ratio of a total mass of [a1] and [a2] to a mass of [b] is from 40/60 to 55/45; the polymerizable vinyl monomer comprises from 30 to 80 parts by mass of (A) a methylmethacrylate monomer, from 10 to 50 parts by mass of (B) a phenoxyethylmethacrylate monomer and/or a 2-hexylethylmethacrylate monomer, and from 1 to 20 parts by mass of (C) a 2,2-bis(4-(meth)acryloxydiethoxyphenyl)propane monomer and/or an ethylene oxide-modified bisphenol A dimethacrylate monomer; the curable resin composition, when cured, has a haze of from 3% to 10%, expressed as a ratio of diffuse transmittance over luminous transmittance; wherein a total content of the polymerizable vinyl monomer, the curing agent, the paraffin, the (meth)acrylic acid, the reducing agent, and the acrylic block copolymer having a structure of formula (II) is at least 90 mass %; and a content of the acrylic block copolymer is from 40 to 70 parts by mass per 100 parts by mass of the polymerizable vinyl monomer. |
地址 |
Tokyo JP |