| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board in which a semiconductor element connection pad of the top layer is less likely to be peeled, and which has a high electric insulation reliability between the semiconductor element connection pads, and an excellent electric connection between the semiconductor element connection pad and an electrode terminal of a semiconductor element.SOLUTION: A wiring board 10 comprises: an insulation base 1 formed so as to laminate a plurality of insulation resin layers 1a to 1d; a semiconductor element connection pad 4 which is embedded so that an upper surface is exposed to the insulation resin layer 1a, and is connected to an electrode terminal T of a semiconductor device S; an external connection pad 5 which is deposed in a lower surface of the insulation base 1, and electrically connected to the semiconductor element connection pad 4 through a wiring conductor 2 provided in an inner part of the insulation base 1. The semiconductor element connection pad 4 includes a base part 4a of which an upper surface external peripheral part is concavely exposed from the upper surface of the insulation resin layer 1a of the top surface, and a projection part 4b projecting from the upper surface of the insulation resin layer 1a to an upper surface central part of the base part 4a.SELECTED DRAWING: Figure 1 |
