SEMICONDUCTOR DEVICE, METAL MEMBER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device, a metal member, and a method of manufacturing a semiconductor device which can eliminate assembly defects.SOLUTION: A flange 2 of one open end 10a of a tubular contact member 10 is joined to a conductive plate 22 of an insulating substrate by a solder 27. An external electrode terminal 25 is fitted to a main body tubular portion 1 of the tubular contact member 10. The tubular contact member 10 has a protruding portion 5 protruding inward from an inner wall 10c of the main body tubular portion 1. The protruding portion 5 is provided on an open end 10a side of the tubular contact member 10 over the entire circumference of the inner wall 10c of the main body tubular portion 1. The protruding portion 5 has a thickness t1 that is deformed by a load when the external electrode terminal 25 is press-fitted into the main body tubular portion 1. A height h1 at which the protruding portion 5 is arranged is set to a height that can block a solder 27a that has crawled up on the inner wall 10c of the main body tubular portion 1 so that a gap is formed with the lower end portion of the external electrode terminal 25 inserted to the predetermined depth of the main body tubular portion 1.SELECTED DRAWING: Figure 2