| 发明名称 |
Electroless copper plating solution. |
| 摘要 |
<p>An electroless copper plating solution comprising a cupric salt, a copper complexing agent, a reducing agent, a pH adjustor, L-arginine and at least one of alpha , alpha min -dipyridyl and a cyano complex compound can give plated films high in ductility and adhesive strength and excellent in mechanical properties.</p> |
| 申请公布号 |
EP0378407(A1) |
申请公布日期 |
1990.07.18 |
| 申请号 |
EP19900300308 |
申请日期 |
1990.01.11 |
| 申请人 |
HITACHI CHEMICAL COMPANY LTD.;HITACHI BORDEN CHEMICAL PRODUCTS INC. |
发明人 |
TAKITA, TAKAO;SHIMAZAKI, TAKESHI;AKAZAWA, SATOSHI;KURAMOTI, KAZUICHI, HITACHI KASEI KOGYO K. K.;TOYODA, HIROYUKI |
| 分类号 |
C23C18/40 |
主分类号 |
C23C18/40 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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