| 发明名称 |
Apparatus for interlayer planarization of semiconductor material |
| 摘要 |
A pad for planarizing the surface of a semiconductor wafer. The pad includes at least two layers. One layer has a hydrostatic modulus which is different from the hydrostatic modulus of the other pad.
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| 申请公布号 |
US5257478(A) |
申请公布日期 |
1993.11.02 |
| 申请号 |
US19920829736 |
申请日期 |
1992.01.31 |
| 申请人 |
RODEL, INC.;WESTECH SYSTEMS, INC. |
发明人 |
HYDE, THOMAS C.;ROBERTS, JOHN V. H. |
| 分类号 |
B24B37/00;B24B13/01;B24B37/04;B24D13/14;H01L21/304;(IPC1-7):B24B7/22;B24B1/00 |
主分类号 |
B24B37/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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