发明名称 METHOD AND DEVICE FOR FORMING LEAD WIRE OF ELECTRONIC PARTS
摘要 PURPOSE:To prevent the insufficient connection of connecting sections of lead wires and performance deterioration of other electronic parts at the time of forming the lead wires by forming the lead wires in a state where the main body of the electronic parts is released from a restricted state by temporarily releasing the main body from a held state by actuating a holding arm. CONSTITUTION:While the main body 14a of electronic parts 14 is held with a holding arm 11, the lead wire 14b of the parts 14 is formed by actuating a forming device 12 used for forming the wire 14b. At the time of forming the lead wire 14b with the device 12, the main body 14a is temporarily released from the held state by actuating the arm 11. Then the wire 14b is formed in a state where the main body 14a is released from the restricted state. Therefore, no tensile force nor compressive force acts on the main body 14a of the parts 14 and the insufficient connection of the connecting section of the wire 14b and performance deterioration of other electronic parts can be prevented.
申请公布号 JPH0684723(A) 申请公布日期 1994.03.25
申请号 JP19920257412 申请日期 1992.08.31
申请人 FAR EAST ENG KK 发明人 MORIYAMA YASUO
分类号 H01G13/00;H01L23/48 主分类号 H01G13/00
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