发明名称 |
Method and apparatus for applying solder flux to a printed circuit |
摘要 |
Apparatus and methods for a system and process for applying a flux coating to a circuit board by pulsing an airless spray gun on and off to achieve excellent circuit board through-hole penetration and uniform film thickness. An overspray collection system is provided which reduces overspray and increases material utilization and transfer efficiency. A gun positioning mechanism, which can be automated, accurately locates the gun relative to the circuit board.
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申请公布号 |
US5368219(A) |
申请公布日期 |
1994.11.29 |
申请号 |
US19930146924 |
申请日期 |
1993.11.04 |
申请人 |
NORDSON CORPORATION |
发明人 |
HOGAN, PATRICK T.;CHRISTYSON, RICHARD G. |
分类号 |
B23K3/00;B05B12/06;B05B12/12;B05B15/08;B23K1/20;H05K3/34;(IPC1-7):B05B15/00;B05B15/02 |
主分类号 |
B23K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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