发明名称 RADIATION SENSITIVE RESIN COMPOSITION AND RESIST PATTERN FORMING METHOD USING SAME
摘要 PURPOSE: To enable exposure with radiation and development with an existing developing device by incorporating alkali-soluble phenolic resin, specified poly(siloxane) and a specified acid generating agent. CONSTITUTION: Alkali-soluble phenolic resin, poly(siloxane) having a C-O-Si bond per one monomer unit and an acid generating agent which is degraded by the action of radiation and generates an acid are incorporated. Since the poly(siloxane) has water repellency, the resultant radiation sensitive resin compsn. has action to inhibit the dissolution of the phenolic resin in an aq. alkali soln. Since the poly(siloxane) has such a property that alkoxyl groups in the poly(siloxane) are readily released by an acid and hydroxyl groups are substd. for the alkoxyl groups, hydroxyl groups (silanol) are substd. for the side chains of released alkoxyl groups and a silanol-rich polymer is formed. When the radiation sensitive resin compsn. is irradiated, an acid is generated from the acid generating agent contained in the compsn.
申请公布号 JPH08320562(A) 申请公布日期 1996.12.03
申请号 JP19950124937 申请日期 1995.05.24
申请人 OKI ELECTRIC IND CO LTD 发明人 ITO TOSHIO
分类号 G03F7/004;G03F7/023;G03F7/038;G03F7/075;G03F7/26;G03F7/38;G03F7/40;H01L21/027;H01L21/302;H01L21/3065;H01L21/312 主分类号 G03F7/004
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