| 摘要 |
A semiconductor socket converter module having a simplified low-cost structure composed of a plurality of circuit boards of high connection reliability and adapted for replacement of I/O terminals, for example, to upgrade a semiconductor package on a motherboard. The module structure comprises a socket board adapted to receive a semiconductor package, a converter board that carries the socket board and a signal converter device, and a circuit board interposed between the socket board and the converter board, the circuit board including holes for receiving general I/O pins on the socket board and further including conductor patterns for connecting particular I/O pins on the socket board electrically with the signal converter device. |
