| 摘要 |
A high speed circuit interconnection apparatus involves an electrical connection assembly between a multilayer printed circuit board (PCB) and a connector for receiving the PCB. The PCB has a plurality of logic signal lines and a plurality of power and ground lines, each of the logic signal lines terminating in a contact tab, the PCB having a contacting edge with power and ground conductors affixed thereto, electrically connected to the power and ground lines. The logic and power and ground lines are positioned to provide a desired transmission line impedance. The connector has a plurality of logic contactors, each firmly contacted by a corresponding contact tab when the PCB is inserted, closing a secondary contact. The secondary contact is made at a point on the logic contactor to minimize the length of each logic signal path made up of the corresponding contact tab and the corresponding contactor. The connector further has a plurality of power and ground contactors for electrically connecting to the power and ground conductors, the power and ground contactors each being configured to firmly contact the power and ground conductors at a point to minimize the length of each of the power and ground signal return paths formed by the power and ground conductors and each corresponding power and ground contactor. This plurality of power and ground contactors provides power supply voltages at required high current levels. The logic contactors and the power and ground contactors are positioned on the connector to minimize the distance between the logic current paths and the power and ground signal return paths when the PCB is inserted into the connector to approximately maintain the desired transmission line impedance.
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