发明名称 THERMALLY EXPANDABLE MICROCAPSULE OF HIGH HEAT RESISTANCE AND METHOD FOR PRODUCING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a thermally expandable microcapsule of relatively small size, with such high heat resistance as to undergo neither burst nor contraction at high temperatures, that is, smaller than 25μm in size prior to expansion and 180°C or higher in the maximum expansion temperature. SOLUTION: The thermally expandable microcapsule is such that a volatile expanding agent is included as the core agent in a shell formed by polymerizing a monomer blend comprising a nitrile-based monomer and methacrylic acid as polymerizable monomer components, wherein the methacrylic acid accounts for≥10 wt.% of the monomer components. The volume-average size of this microcapsule is smaller than 25μm. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005232274(A) 申请公布日期 2005.09.02
申请号 JP20040041876 申请日期 2004.02.18
申请人 SEKISUI CHEM CO LTD 发明人 KAWAGUCHI YASUHIRO;NAKADA YASUSHI
分类号 C09K3/00;B01J13/18;(IPC1-7):C09K3/00 主分类号 C09K3/00
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