| 摘要 |
PROBLEM TO BE SOLVED: To connect with each other simply and with good reliability both the front and rear surfaces of a wiring board. SOLUTION: In a manufacturing method of the wiring board, first and second plated underlaying layers 2, 6 having desired wiring patterns are printed and formed on both the front and rear surfaces of a sheet-form insulating base-material 1. Then, a needle-form member 3 is so pierced in the sheet-form base-material 1 having at least the plated underlaying layer 2 which is one of the plated underlaying layers as to form a through-hole 4, while leaving a break-end 5 of the underlaying layer 2 in the portion of the needle-form member 3 being pierced therein. Further, the underlaying layers 2, 6 are so subjected to electroless-plating processing as to form first and second wiring layers 7, 8 comprising plated metal layers. At the same time, the plated underlaying layers 2, 6 present on the break-end 5 are so used as to form in the through-hole 4 a plated metal layer 9 for connecting the first and second wiring layers 7, 8, and as to make it the connective portion of the through hole. COPYRIGHT: (C)2006,JPO&NCIPI |
