| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide resin having high solubility in an organic solvent and can give a coating film simultaneously having high heat resistance, curling resistance, and adhesion when used as a coating-forming material formed into a protective film on the surface of a printed wiring board. SOLUTION: The polyimide resin essentially consists of repeating units represented by formula (1) and repeating units of formula (2). COPYRIGHT: (C)2007,JPO&INPIT
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