发明名称 WIRING SUBSTRATE EQUIPPED WITH ISOMETRIC WIRING CAPABLE OF APPLIED WITH LARGE CURRENT
摘要 PROBLEM TO BE SOLVED: To provide an isometric wiring substrate to which a large current is applied. SOLUTION: The wiring of composite structure configured of a metal plate made from such metal as copper and includes an isometric branch wiring member which branches in isometric manner once or more times, is provided on an insulator substrate. The isometric branch wiring member branches in tournament manner. A plurality of tournaments can be combined together. The number of branching times can be set at one's discretion. The wiring containing a large current wiring member which is formed from a copper plate made from such metal as copper and to which a plurality of isometric printed wirings are connected, is provided on the insulator substrate. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008210944(A) 申请公布日期 2008.09.11
申请号 JP20070045396 申请日期 2007.02.26
申请人 TOSHIBA TEC CORP 发明人 HARA YOSHIAKI;TAKAYAMA YOSHIHIRO
分类号 H05K1/02;H01L23/12;H01L25/07;H01L25/18 主分类号 H05K1/02
代理机构 代理人
主权项
地址