| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition giving a relief pattern with high sensitivity, and to form a cured relief pattern having chemical resistance in the pattern after curing on a substrate. <P>SOLUTION: The positive photosensitive resin composition comprises (A) 100 parts by mass of an alkali-soluble polyimide, (B) 1-100 parts by mass of an allyl group-containing compound and (C) 1-100 parts by mass of a compound which generates an acid under light. <P>COPYRIGHT: (C)2008,JPO&INPIT |
