发明名称 |
SURFACE-TREATED COPPER FOIL AND COPPER-CLAD LAMINATE |
摘要 |
In order to provide a surface-treated copper foil that meets all conditions for a copper foil related to a polyimide, including adhesive strength, acid resistance, and etching properties, as well as a laminated circuit board using the surface-treated copper foil, the present invention provides either: a surface-treated copper foil composed by attaching an Ni-Zn alloy to at least one side of an untreated copper foil, wherein the Zn content (wt%) (attached amount of Zn/(attached amount of Ni + attached amount of Zn)×100) is equal to or greater than 6% and equal to or less than 15% and the attached amount of Zn is 0.08 mg/dm2 or more; or a surface-treated copper foil that is a CCL composed by attaching a polyimide film to a surface-treated copper foil composed by attaching a Ni-Zn alloy to at least one side of an untreated copper foil, wherein the Zn content (wt%) (attached amount of Zn/(attached amount of Ni + attached amount of Zn)×100) in the Ni-Zn alloy attached to the surface of said metal foil of the CCL is equal to or greater than 6% and equal to or less than 15% and the attached amount of Zn is 0.08 mg/dm2 or more. |
申请公布号 |
WO2010010893(A1) |
申请公布日期 |
2010.01.28 |
申请号 |
WO2009JP63095 |
申请日期 |
2009.07.22 |
申请人 |
THE FURUKAWA ELECTRIC CO., LTD.;FUJISAWA, SATOSHI;SUZUKI, YUJI;UNO, TAKEO |
发明人 |
FUJISAWA, SATOSHI;SUZUKI, YUJI;UNO, TAKEO |
分类号 |
C25D7/06;B32B15/01;B32B15/088;H05K1/09 |
主分类号 |
C25D7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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