ELECTRONIC-DEVICE-SEALING CURABLE HYGROSCOPIC RESIN COMPOSITION, SEALING RESIN, AND ELECTRONIC DEVICE

摘要

An electronic-device-sealing curable hygroscopic resin composition that is a polyfunctional methacrylate that contains at least a methacrylate oligomer (a) that has a number average molecular weight of 1,500-5,000, a low-molecular methacrylate (b) that has an average molecular weight of 170-500, a moisture-reactive metal-organic compound (c), and a polymerization initiator (d), wherein the number of methacryloyl groups per molecule of the methacrylate oligomer (a) and the low-molecular methacrylate (b) is 1.5-3. Also, a sealing resin and an electronic device.