Apparatus and method for electronic sample preparation

摘要

A method and apparatus for preparing electronic samples for a subsequent treatment, e.g., application of a failure analysis treatment. In one embodiment, an electronic device is mounted on a thermally controlled plate and a select temperature is applied thereto. While maintaining the select temperature applied to the thermally controlled plate, a sample preparation process is performed on the electronic device, such as, e.g., performing polishing, thinning, milling, lapping or extracting one or more semiconductor dies that form the electronic device.

主权项

1. A method for preparing electronic devices for analysis, comprising:
mounting an electronic device on a thermally controlled plate; applying a select temperature to the thermally controlled plate, the select temperature being chosen to mitigate non-planar surface conditions associated with one or more dies forming part of the electronic device; and while maintaining the select temperature applied to the thermally controlled plate, performing a process on the electronic device to prepare the electronic device for analysis, wherein the process to prepare the electronic device for analysis comprises at least one of grinding, polishing, thinning, milling, lapping and extraction of one or more semiconductor dies forming the electronic device.