发明名称 SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate for mounting an electronic element capable of reducing generation of peeling and cracking between a lid and a frame caused by the frame being thermally deformed and distorted, and an electronic device.SOLUTION: A substrate 1 for mounting an electronic element, constituted of a plurality of insulating layers, includes: a substrate 2b, having an electronic element mounting part 11 on a center area of a top surface of which an electronic element 10 is mounted; a base body 2, formed on the top surface of the substrate 2b, surrounding the electronic element mounting part 11, having a frame 2a, inside or at a bottom of which a closed space 4, filled with a gas, is formed; and an external circuit connection electrode 9, formed at a lower surface of the base body 2.SELECTED DRAWING: Figure 1
申请公布号 JP2016219616(A) 申请公布日期 2016.12.22
申请号 JP20150103495 申请日期 2015.05.21
申请人 KYOCERA CORP 发明人 ICHIKI SHINJI;INOUE TOMOHIRO;HONTO HIROKAZU
分类号 H01L23/20;H01L23/12;H05K1/02 主分类号 H01L23/20
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