| 摘要 |
<p>PURPOSE:To eliminate the necessity of a distinction between a power terminal and an earthing terminal for the use of a semiconductor device by forming or packaging a rectifier circuit on a semiconductor chip. CONSTITUTION:The power terminals 14 and 16 are connected with an electronic circuit (internal circuit) 10 formed on the semiconductor chip through the rectifier circuit 12 The circuit is constituted as the semiconductor chip or constituted by being packaged with the semiconductor chip. Then the rectifier circuit 12 is formed on the semiconductor chip together with the internal circuit 10 or is arranged in the same package. Thus the rectifier circuit 12 intervenes between the internal circuit 10 and the power terminal of the semiconductor device, so that the internal circuit 10 is normally actuated even though the polarity of DC power source applied to the semiconductor device is inverted and usability and the degree of freedom for the design of an application device are improved.</p> |
